Automatic Non-destructive Dicing Machine
Product Description
Compatible with solar cells ranging from 156-230mm, with the flexibility to switch between different specifications without the need to replace parts. Equipped with a 12-megapixel industrial camera, offering high resolution for more precise dicing positioning. Features imported lasers, with independent control between each laser unit, ensuring the operational efficiency of the equipment.
Product Parameters
| Product parameter |
Data |
| Designed Production Capacity |
≥3600 pcs/h |
| Dicing Function |
1/2,1/3,1/4 |
| Utilization Rate |
98% |
| Solar Cell Type |
Monocrystalline/Polycrystalline Solar Cell Solar,Cell Size 156-230mm,Thickness 0.14-0.2mm |
| Dicing Precision |
±0.1mm |
| Defect Rate |
≤0.05% |
| Loading Inspection |
Inspects the direction of the incoming solar cells, edge chipping, and corner missing, with a resolution of 0.3mm. |
| Unloading Inspection |
Detects the size of the cells, the straightness of the dividing lines, and checks for cracks, edge chipping, and corner missing. |
| Power |
Rated Power 10kW, Peak Power 15kW |
| Air Consumption |
0.5m³/min |
| Weight |
3.5T |
| Equipment Dimensions |
L3858mm * W1850mm * H2454mm |
Detailed Photos
inside view mechinical laser cut
High precision and quality:
• Accurate cutting: These machines can achieve high-precision cutting, ensuring that the cut edges are smooth and clean with minimal kerf width. This high level of precision is crucial for applications where exact dimensions and fine cuts are required, such as in the semiconductor and electronics industries. For example, in the production of microchips, precise cutting is essential to ensure the proper functioning and performance of the chips.
• Minimal damage to materials: Since the cutting process is non-destructive, there is minimal impact on the material's structure and properties. This helps to maintain the integrity and quality of the materials being cut, which is especially important for sensitive materials like semiconductors, wafers, and fragile components.
Company Profile
Beijing X-Solar Energy Co., Ltd. was found in 2020, and headquartered in Beijing. It's a science and technology innovative energy enterprises with the main business of future cell R&D, flexible photovoltaic modules, building photovoltaic module production, high-end equipment manufacturing, production line delivery, and AI-CITY wisdom energy management services.
In July 2023, the company's first demonstration factory, Jiangsu X-Solar Green-building Technology Co., Ltd., was established in Jiangyin CNBM Jetion Industrial Park. Meanwhile, Jiangsu YuanTeng FengSheng Intelligent Manufacturing Technology Co., Ltd., a wholly-owned equipment company of the company, delivered the world's first "three-in-one" automatic production line for Jiangyin base. The production line can be compatible with the production of three categories: X-Solar Light shadow series (flexible PV modules), X-Solar Light rhyme series (building PVtile modules), X-Solar Light Curtain series (building PV wall modules), and customized products. X-Solar PV series products have the advantages of integrating architectural aesthetics, complying with design specifications and creating energy value, which have been widely recognized and praised by customers in domestic and overseas.
In 2024, the company has added two regional centers in Shanghai and Guangzhou of China, and set up the Hong Kong X-Solar Future Energy Research Institute, and overseas sales companies in Australia, Italy, Germany, Saudi Arabia and Argentina. The company has launched a global layout to provide sustainable energy products and services to many countries, and has contributed to the "carbon neutrality and carbon peak".
Exhibition Display
FAQ
1. Working Principle Questions
1. Question: What is the basic working principle of a non-destructive dicing machine?
Answer: Non-destructive dicing machines typically use techniques like laser cutting, waterjet cutting, or ultrasonic cutting. For example, in laser cutting, a focused laser beam is used to vaporize or melt the material along the cutting path precisely, while waterjet cutting uses a high-pressure stream of water (sometimes with abrasive particles added) to erode the material in a controlled way to achieve cutting without significant damage to the material's integrity.
2. Question: How does laser-based non-destructive dicing differ from traditional mechanical dicing?
Answer: Traditional mechanical dicing uses cutting tools like blades that physically cut and can cause mechanical stress and damage to the material. Laser-based non-destructive dicing, on the other hand, uses a focused laser beam to remove material through vaporization or melting, minimizing mechanical impact and allowing for finer and more precise cuts with less damage to the internal structure of the material.
2. Application Questions
1. Question: In which industries are non-destructive dicing machines commonly used?
Answer: They are widely used in the semiconductor industry for dicing wafers into individual chips while maintaining their electrical properties intact. Also in the electronics manufacturing industry for cutting components like circuit boards, in the optical industry for shaping lenses and optical wafers, and in the medical device manufacturing industry for cutting precision parts of devices where material integrity is crucial.
2. Question: Can non-destructive dicing machines be used for cutting flexible materials like polymer films?
Answer: Yes, certain types of non-destructive dicing machines, such as those using laser cutting with appropriate power and beam parameters or ultrasonic cutting, can effectively cut flexible materials like polymer films. The key is to adjust the cutting parameters to ensure clean cuts without deforming or damaging the film's functionality.
3. Performance and Precision Questions
1. Question: What factors affect the precision of a non-destructive dicing machine?
Answer: The precision is affected by factors such as the stability of the cutting mechanism (e.g., the accuracy of laser beam positioning in laser cutting or the consistency of waterjet pressure in waterjet cutting), the quality of the control system that determines the cutting path and speed, and the flatness and stability of the workpiece being cut. Also, the resolution of the input design or cutting pattern plays a role.
2. Question: How accurate can the cuts be with a non-destructive dicing machine?
Answer: Depending on the type and quality of the machine, cuts can be accurate to within a few micrometers or even sub-micrometer levels in advanced semiconductor dicing applications. For example, in high-end laser dicing machines used for microchip production, the kerf width can be extremely narrow and the alignment with the designed cutting lines can be highly precise.
4. Equipment Selection Questions
1. Question: How do I choose the right non-destructive dicing machine for my specific material and cutting requirements?
Answer: Consider the type of material you need to cut (e.g., hard ceramic, soft polymer, semiconductor wafer), the required precision of the cuts (in terms of dimensions and tolerances), the production volume (whether it's for small batches or mass production), and the complexity of the cutting patterns. For instance, if you're working with semiconductors and need extremely high precision for mass production, a high-end laser dicing machine with good automation features would be a suitable choice.
2. Question: What are the main differences between different models of non-destructive dicing machines in terms of features?
Answer: Different models may vary in their cutting mechanism (laser, waterjet, etc.), maximum cutting size of workpieces, cutting speed, automation level (such as the ability to load and unload workpieces automatically, integrate with production lines), and the level of precision they can achieve. Some may also have additional features like real-time monitoring and feedback systems for better quality control.
5. Operation and Maintenance Questions
1. Question: What are the basic steps for operating a non-destructive dicing machine?
Answer: First, prepare the workpiece and load it onto the machine's worktable securely. Then, input the cutting design or pattern into the machine's control system, set parameters like cutting speed, power (in case of laser cutting), etc. Next, perform a calibration check if needed to ensure accurate positioning. Finally, start the cutting process and monitor it for any anomalies during operation.
2. Question: How often should a non-destructive dicing machine be maintained?
Answer: Regular maintenance should be done daily to clean the machine, check for loose parts, and ensure proper lubrication if applicable. A more comprehensive maintenance check, including inspection of key components like the cutting mechanism (e.g., laser source health in laser cutting machines), electrical systems, and calibration of positioning systems, should be carried out monthly or after a certain number of operating hours (e.g., every 1000 hours), depending on the manufacturer's recommendations.
6. Cost Questions
1. Question: What is the typical cost range of a non-destructive dicing machine?
Answer: The cost can vary widely depending on the type, precision, and automation level. Basic models for simple cutting tasks might start from around $10,000 to $20,000. However, high-end laser dicing machines with advanced precision and automation capabilities for semiconductor and high-tech applications can cost hundreds of thousands or even millions of dollars.
2. Question: How can I calculate the return on investment (ROI) for purchasing a non-destructive dicing machine?
Answer: Calculate the total cost of the machine including purchase price, installation, training, and maintenance over its expected lifespan. Then estimate the savings in terms of reduced material waste (due to precise cutting), increased production efficiency (faster cutting times), and potential revenue from higher-quality products that can be produced. Divide the net savings or additional revenue by the total investment cost to get the ROI over a specific period.
7. Safety Questions
1. Question: What safety precautions should be taken when operating a non-destructive dicing machine?
Answer: Operators should wear appropriate personal protective equipment such as safety glasses, gloves, and protective clothing. Ensure the machine is properly grounded to prevent electrical hazards. In the case of laser cutting machines, there should be proper shielding to prevent laser radiation exposure. Also, follow proper procedures for loading and unloading workpieces to avoid pinch points and other mechanical injuries.
2. Question: Are there any potential environmental impacts associated with non-destructive dicing machines?
Answer: In some cases, like waterjet cutting with abrasive particles, proper disposal of the waste water containing abrasives needs to be managed to avoid environmental pollution. For laser cutting, depending on the materials being vaporized, there could be fumes that need to be properly ventilated and filtered to meet environmental regulations.
Compatible with solar cells ranging from 156-230mm, with the flexibility to switch between different specifications without the need to replace parts. Equipped with a 12-megapixel industrial camera, offering high resolution for more precise dicing positioning. Features imported lasers, with independent control between each laser unit, ensuring the operational efficiency of the equipment.
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